HP ProCurve 2312 Switch

Die Frage

1. Kann man einen HP ProCurve 2312 Switch (J4817A) zu einem HP ProCurve 2512 Switch (J4812A) upgraden?

Vergleich der Spezifikationen

	ProCurve 2312 Switch (J4817A)	Ähnlichkeit	ProCurve Switch 2512 (J4812A)
Technical features
External I/O ports	12 RJ-45 10/100 ports (IEEE 802.3 Type 10Base-T; 802.3u Type 100Base-TX)		12 10/100 ports (IEEE 802.3 Type 10Base-T, IEEE 802.3u Type 100Base-TX)
	2 open transceiver slots		2 open transceiver slots
	1 RS-232C DB-9 download port		1 RS-232C DB-9 console port
Rack mounting	Mounts in a standard 19 in. rack (hardware included)		Mounts in a standard 19 in. rack (hardware included)
Memory and Processor	Packet buffer size: 6 MB shared packet buffers; RAM/ROM capacity: 26 MB; Processor type and speed: ARM7TDMI @ 62.5 MHz; Flash capacity: 2 MB		Processor type and speed: ARM7TDMI @ 62.5 MHz; Packet buffer size: 6 MB; RAM/ROM capacity: 26 MB; Flash capacity: 2 MB
Latency	<10 µs (LIFO)		<10 µs (LIFO)
Address Table size	4,096 entries		4,096 entries
routing/switching capacity	9.6 Gbps		9.6 Gbps
throughput	4.8 mpps (64-byte packets)		4.8 million pps (64-byte packets)
Management Features			ProCurve Manager (included); ProCurve Manager Plus; command line interface; Web browser; configuration menu; out-of-band management; (serial RS-232C)
Communications	IEEE 802.3x Flow Control		IEEE 802.3x Flow Control
			RFC 3376 IGMPv1/v2/v3
			IEEE 802.1D Spanning Tree
			IEEE 802.1w Rapid Convergence Spanning Tree
			IEEE 802.3ad Link Aggregation Control Protocol
			RFC 1492 TACACS
			IEEE 802.1X Network Login
			IEEE 802.1Q VLANs
			IEEE 802.1Q GVRP
			IEEE 802.1p Priority SNMPv1/v2c
			RFC 1493 Bridge MIB
			RFC 1213 MIB II
			RFC 2819 Four groups of RMON: 1 (statistics), 2 (history), 3 (alarm) and 9 (events)
			RFC 3164 Syslog; XRMON
			RFC 2613 SMON; RFC 2674 802.1p and IEEE 802.1Q Bridge MIB
Power Requirements	100–127 VAC/200–240 VAC; 50/60 Hz		100–127 VAC/200–240 VAC; 50/60 Hz
Power availability	2.4/1.2 A max		2.4/1.2 A max
Power consumption	36W		36W
Operating conditions
Electromagnetic emissions	FCC Class A; EN 55022/CISPR 22 Class A; VCCI Class A		FCC Class A; EN 55022/CISPR 22 Class A; VCCI Class A
Operating Temperature Range	0 to 55° C		0 to 55° C
Operating Humidity Range	15 to 95% non-condensing		15 to 95% non-condensing
Dimensions / weight / warranty
Dimensions (w x d x h)	44.2 x 20.3 x 4.6 cm		44.2 x 20.32 x 4.57 cm
Weight	2.7 kg		2.72 kg
Warranty	Lifetime warranty: for as long as you own the product, with next-business-day advance replacement (available in most countries)		Lifetime warranty: for as long as you own the product, with next-business-day advance replacement (available in most countries)

Analyse der Hardware

Unter der Vermutung, dass es sich bei den beiden Modellen um die gleiche Hardware handelt, welche auch beide mit der gleichen Software aktualisiert werden, müsste sich die Information des Modells in einem Flash Speicher finden lassen. Um diese Speicher zu finden, wurde die Hardware analysiert. Hier die Auflistung der betreffenden Bausteine:

Name	Anzahl	Position	Hersteller	Marking	Wert	Funktion	Bemerkung
K4S643232E-TC60	3	U1, U3, U4	Samsung	SAMSUNG 223 K4S643232E-TC60 UYD993DA KOREA	-	8MB SDRAM	macht insgesamt 24MB RAM
AM29LVO17D	1	U2		AM29LVO17D	-	2MB Flash Speicher	macht insgesamt 2MB ROM
	1	BGA1			-	ASIC+CPU	vermutlich ASIC mit integriertem ARM7TDMI und den restlichen 2MB RAM intern

Weiteres Vorgehen

Flash Speicher auslesen (dumpen). Evtl. mit On Borad Adapter für das TSOP Format des Flash ICs.

Nach den Modelinformationen im Dump suchen

Wenn gefunden: Ändern und umprogrammieren

Wenn nicht 2512 finden und versuchen dessen Flash zu übertragen